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BasTech to Hold Local Tech Talk

Dayton, OH—January 30, 2020— BasTech, in conjunction with 3D Systems, is holding a 3D systems’ tech talk at the Carillon Brewing Company, 1000 Carillon Blvd., Dayton Ohio, on February 20th, 2020 from noon to 6 pm.
Explore, learn about, and view the latest 3D printing materials, software, technology platforms and applications!
Stop by anytime on that date to have a beer on us and see our latest technology innovations and solutions from materials, printing, software, and on-demand part services. This unique opportunity will also provide one-on-one time with our highly knowledgeable application specialists and engineers from both 3D Systems and BasTech who will answer your questions and provide solutions to your unique challenges.
Attendees will be able to attend one of the specialized classroom sessions to learn more about specific capabilities and workflows:
  • Applications / Materials covering both prototyping & production use models (1:00 PM to 2:00 PM)
  • 3D Printing Workflow (Geomagic Design X™ / Scanning; 3D Sprint™ / 3DXpert™; materials + printing technologies; Geomagic Control X™ for metrology) (3:30 PM to 4:30 PM)
Eight (8) new materials that 3D Systems recently launched that can be printed on their Figure 4 technology platform will be featured also – a scalable 3D production solution.
Registration is required to attend but the event is free of charge. Food and drinks will be provided. Register at
Please contact Ben Staub at for all media inquiries.
About BasTech
BasTech is a world-class additive (3D) manufacturer and equipment re-seller offering prototyping and production manufacturing while offering expert technical assistance, application expertise, service, training, and support around the region and throughout United States.
About 3D Systems
For over 30 years 3D Systems has bridged the gap between inspiration and innovation by connecting their customers with the expertise and digital manufacturing workflow required to solve their business, design, or engineering problems.